SKU: 65425777432
Ships within 48 hours · Estimated delivery Aug 25 - Aug 30
- Phonefix aluminum alloy pad(41
UFI-Lite USB3
Huawei smartphones
Identification of external expansion boards (UFS
then right and left movement with the core in between the LCD and the glass
MiJing CH5 Motherboard Layered Platform For iPhone X-12 Pro Max Phone USB Charging - Phonefix aluminum alloy pad(41Mijing CH5 Intelligent motherboard preheating layered desoldering platform with CH5 CH5 BC CH5 E mold for iPhone X 12 Pro Max motherboard disassembly. Mijing CH5 motherboard heating separating welding platform for iPhone 12 11 X series PCB mainboard layering. Function: 1. Preheating platform for iPhone X XS XS Max 11 11 Pro 11 Pro Max 12 12mini 12 Pro 12 Pro Max motherboard layering, support CPU chip, HHD Nand flash, Baseband, glue removal. 2. Precise
US$ 129.50
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US$ 146.00
